LED packaging technology mainly to the high luminous efficiency, high reliability, high cooling capacity, the four directions of the thin re-shuffle by the IPO, currently the main bright spot: silicon-based led security floodlight, COB packaging technology, flip-chip type LED chip package, high-voltage LEDs. And the 2012 Shanghai New International Lighting & New Energy Lighting Exhibition and Forum (Green, Lighting, Shanghai, 2012), authoritative, professional, and international communication platform that was presented to industry professionals.
Silicon LED The reason why the industry more and more attention, because it is stronger than the traditional sapphire substrate LED cooling capacity, the power can be done more Cree focus on the development of silicon-based led security floodlight, it is present The main problem is that the yield is still relatively low, resulting in cost is also high.
COB light production costs are relatively low, heat dissipation and high packing density and higher optical density of features, easy to personalize the design is one of the dominant direction of the future package development. Current problems is the light loss caused by COB reduce the multiple refraction of the first optical lens, and therefore has yet to improve the efficiency of the light and heat increase the production yield of the substrate should be improved.
The flip-chip type led high bay chip package is one of the industry strongly development objectives. Flip-chip chip production than the three-dimensional a lot simpler, and can avoid the off complex process, making the production feasibility increased significantly, coupled with back-end chip technology assisted with the eutectic crystalline solid way, greatly simplify the flip-chip chip package threshold in the future carbon reduction drive, the flip-chip type chip package is a good solution.