High-power LED products and devices in the application process, thermal, electrostatic protection, welding has a great impact on the need to attract the customers of the application side attaches great importance to its characteristics.
Semiconductor light-emitting diode chip technology limitations of LED photoelectric conversion efficiency remains to be improved, especially in high power led applications, because of the higher power, about 60 percent more electrical energy into heat release (along with the development of semiconductor technology photoelectric conversion efficiency will be gradually increased), which requires the end-customer to do when the application of high-power LED products heat work to ensure the normal work of the high power led applications.
1. Effective cooling surface area:
1W high power led high bay white (other colors are basically the same) Division I recommended to the sum of the effective cooling surface area of the heat sink ≥ 50-60 square centimeters. 3W products, recommended the sum of the effective cooling surface area of the heat sink than 150 square centimeters, as the case of higher power and test results to increase as much as possible to ensure that the heat sink temperature does not exceed 60 ℃.
2. Connection method:
Please ensure that the two contact surfaces smooth connection of high power led applications substrate and heat sink, good contact, to enhance the degree of integration of the two contact surfaces, it is recommended that the surface coating layer of thermal grease in the bottom of the LED substrate or heat sink (thermal grease thermal conductivity the ≥ 3.0W/mk), thermal grease evenly coated, amount, and then screw press fit fixation.