LED industry in the past in order to get the full white LED beam, once the development of large-size LED chips trying to take this way to achieve the desired goals. But, in fact, exert power white LED lasts for more than 1W beam but will decline in the luminous efficiency of 30% relative reduction of 20. In other words, if the brightness of the white LED is several times larger than the traditional White LED lights, the power consumption characteristics beyond fluorescent lights, then you need to overcome the following four topics: inhibit the temperature rise to ensure that the service life, improve the luminous efficiency, and Luminescence Properties of equalization.
Temperature rise solution to the problem is to reduce the package thermal impedance; to maintain the service life of White LED lights is to improve the chip shape, a small chip; improve the LED luminous efficiency of the method is to improve the chip architecture, small chip; The luminescence properties homogenization The method is to improve the led high bay packaging methods, these methods have been developed one after another.
Due to the increased power but will result in the package thermal impedance is sharply down to below 10K / W, foreign companies have developed high-temperature white LED, and an attempt to improve the problem. In practice, however, high-power White LED lights heat than low-power LED a few times more, and the temperature rise will make the light-emitting efficiency fell sharply. Packaging technology allows high-calorie, but the LED chip junction temperature there is likely to exceed the allowable value of the last industry finally realized that the heat dissipation problem is the fundamental method to solve the package.