Second, the improvement measures
LED lights described above, the main failure mode analysis, from the informed to improve the LED in the actual life of the technology.
(1)cooling technology
Cooling technology has been an important part of the LED application, LED light system can not be heat will cause the junction temperature of the chip serious rise, then the luminous efficiency of a sharp decline in reliability(eg, life, color shift, etc.) will deteriorate; Meanwhile, the high temperature and high fever will make the LED package structure of the internal mechanical stress may further lead to a series of reliability issues. Therefore, in the manufacturing process, you can choose the good thermal conductivity of the base, and makes the LED heat dissipation area as large as possible, thereby increasing the thermal performance of the device.
(2) anti-static technology
Using the GaN chip LED, a large electrostatic will effect. If you do not deal with this problem, it will seriously affect the life of the device. In LED light system design, we should give full consideration to the design of anti-static, and to avoid device failure phenomenon caused by the breakdown of the high electrostatic voltage.
(3) packaging technology
Epoxy material that used by the package, will change because of light and temperature rise. In the use of the original transparent epoxy material browning affect the device spectral power distribution. Therefore, during the time of LED package, we should strictly control the curing temperature. Avoid to result in the premature aging of the epoxy resin.
On the other hand, in order to prevent device corrosion phenomenon we need to pay attention to the injection molding process, the row of clean material inside the bubble as far as possible to reduce the residual amount of water vapor, reducing devices of corrosion chance, while transparent good packaging materials.
(4) optimize the manufacturing process
LED manufacturing process requires an appropriate bonding conditions, if the bond is too large, it will be crushed chips, on the contrary, the device will result in insufficient bonding strength. The LED light system device is easy to take off the loose. Therefore, to ensure that the device bonding strength at the same time. We need to try the best to minimize the damage caused by the process of bonding the chip in order to achieve the purpose of optimization of the bonding process.