LED industry in the past in order to get the full white LED beam, once the development of large-size LED chips trying to take this way to achieve the desired goals. But, in fact, exert power white LED lasts for more than 1W beam but will drop 20 ~ 30% reduction in the relative luminous efficiency. In other words, if the brightness of the High output white led is several times larger than traditional LED power consumption characteristics beyond the fluorescent , you need to overcome the following four topics: inhibit the temperature rise to ensure that the service life, improve the luminous efficiency, and luminescence Properties of equalization.
Temperature rise solution to the problem is to reduce the package thermal impedance; to maintain the service life of led high bay is to improve the chip shape, a small chip; improve the LED luminous efficiency of the method is to improve the chip architecture, small chip; The luminescence properties homogenizationthe method is to improve the LED packaging methods, these methods have been developed one after another.
For light-emitting characteristics of uniformity, is generally believed to improve High output white led uniform concentration of fluorescent material and the phosphor production technology should be able to overcome this trouble. As described above to improve the applied power at the same time, it is necessary to try to reduce the thermal resistance, improved heat dissipation problem. The specific contents are: to reduce the chip to the package thermal impedance, inhibiting the thermal resistance of the package to the printed circuit board, chip cooling smooth.