With the growing demand for LED (light emitting diode) lamps, the new cooling technology enables manufacturers to larger and longer life of the light-emitting diode LED lights output production. LED offers many advantages, including low power consumption, long service life (the bulb can use up to 40,000 hours or longer) and environmentally friendly (no mercury). With the new manufacturing technology to reduce production costs and enhance its cooling capacity of the LED lights, the shortcomings of the LED (for example, the price is higher than incandescent or fluorescent) will disappear.
According to the U.S. Department of Energy, Energy Efficiency and Renewable Energy Office to provide information, cooling is one of the most important factor in the successful design of LED street lights systems. Light-emitting diodes can only be 20% to 30% of the energy converted into visible light, the rest is converted into heat, the circuit board and heat sink must be imported from the LED chip. The excess heat will reduce the LED light output, and shorten its life. Therefore, the enhancement of the thermal efficiency is very important to optimize the LED performance potential.
At present, for the use of high power / high brightness LED substrate or module to be soldered to a metal-based printed circuit board (MCPCB), enhanced cooling printed circuit boards or ceramic substrates, and then stick to substrate received a heat sink. This configuration is widely used in the LED industry, but it is not the best cooling method, and manufacturing costs may be high.
MCPCB and enhanced thermally printed circuit board has a good thermal performance, but the design flexibility is limited, but if you need to improve the thermal performance, the cost may be high, because the need to spend an additional cooling holes processing cost and high thermal conductivity of insulating materials costs. Ceramic substrate thermal conductivity is not cheap ceramic (such as alumina ceramic), thermal conductivity and strong, but the price is very expensive ceramic (such as aluminum nitride ceramics can also be used). All in all, the cost of the ceramic substrate is higher than MCPCB and enhanced thermally printed circuit board substrate.
As an alternative to the above-mentioned substrate, LED panel manufacturers are testing directly on the aluminum panel making the circuit, because this method can provide excellent thermal conductivity. Because of its advantages, LED industry interest in using aluminum, aluminum plate and LED circuit insulation. Now, the thick film technology advances make the LED industry to have access to the benefits of using aluminum plate.
Thick film thermal pulp supplier Heraeus Materials Technology developed aluminum plate material systems (IAMS) is a low-temperature sintering (less than 600 ℃) thick film insulation system can be printed and sintered aluminum panel. The IAMS material system consists of the dielectric paste, silver conductive paste, glass protective layer and the resistor paste. These materials are suitable for 3000,4000,5000 and 6000 series aluminum plate.
Heraeus Thick Film Materials Division of the global LED project manager Mr. Kondo charge said: “IAMS is the insulation system design for the aluminum plate and aluminum can not withstand more than 660 degrees Celsius temperature, standard thick film products based on ceramics at high temperatures sintering temperatures as high as 800 degrees Celsius to 900 degrees.
Mr. Kondo charge explained: “because the IAMS slurry sintering temperature below 600 degrees Celsius, so the system is suitable for aluminum processing conditions. In addition, IAMS’s unique glass system can reduce warpage deformation of the aluminum, while can provide high Break down voltage and excellent thermal conductivity. “