To get a high-power LED street light, it is necessary to prepare a suitable high-power LED chips. where can i buy led bulbs? Usually the manufacture of high-power LED chips are summarized as follows:
① large size. By increasing the effective light emitting area and the size of the single LED, to promote uniform current distribution in order to achieve the desired luminous flux through the TCL layer. However, simply increase the light emitting area can not solve the heat dissipation and light, and can not achieve the desired luminous flux and the practical application of effects.
② silicon backplane for flip-chip. First prepared for eutectic welding of large-size LED chips, while preparation of the corresponding size of the silicon backplane for eutectic welding deposit conductive layer and leads to a conductive layer (ultrasonic gold ball solder joints), and produced in the silicon backplane , eutectic welding equipment will be large-size LED chip and the silicon base plate welded together. Such a structure is more reasonable to take into account both the light taking into account the heat dissipation problem, which is the mainstream of high-power LED production.
③ ceramic substrate for flip-chip. The first use of the LED chip general-purpose equipment to preparation of a has a suitable Total crystal welding electrode structure large a light area of the LED chip and the corresponding ceramic base plate and the ceramic substrate produced a total crystal welding conductive layer and leads to conductive layer, then the use of eutectic soldering The equipment will be large-size LED tubes chip and the ceramic base plate welded together. where can i buy led bulbs? Such a structure is taken into consideration the light taking into account the heat dissipation problem, and the ceramic substrate of high thermal conductivity ceramic plate, the cooling effect is very satisfactory, the price is relatively low, so a more appropriate substrate material, and can for the futureintegrated circuit integration package to reserve space.
④ sapphire substrate transition method. InGaN chip according to the traditional manufacturing method in the PN junction grown on sapphire, the sapphire substrate removal, where can i buy led bulbs? and then connect on the traditional materials, manufacturing the upper and lower electrode structure of the large size blue LED chip.
⑤ AlGaInN the silicon carbide (SiC) on the back light method. PN-type electrode at the bottom and top of the chip, using a single wire bonding, good compatibility, easy to use, it would become AlGaInN LED another mainstream products.