Free packaged LED lamps with secondary optical design

　　No new package LED with better cooling conditions, while integrating epitaxial grains and packaging process can be more easily with secondary optical design lighting;

　　LED light source applications will be following the LCD backlight applications demand peaks, gradually shifted to the LED general lighting applications. However, the LCD backlight is different design, LCD backlight compared with the illumination light pattern without considering the application conditions, the unit light-emitting efficiency of the main requirements of the module; LED lighting applications, but in addition the brightness requirements, additional considerations must be light type , heat, whether it is conducive to the second optical design, with lighting design and configuration requirements, in fact, the LED light source components that require higher.

　　Early LED light source components, packaging materials are mainly used artillery-type package, for use in high luminous efficiency of blue LED initially quite common, and in smart phones, mobile phones thin design needs to promote, the use of surface mount (surface-mount devices; SMD ) patterns of the LED light source demand is rising, while the use of surface mount technology LED light source element design, available in tape and reel loaded with material feed to accelerate production and processing performance increase processing efficiency through automation of production, but also to bring LED package the new application markets and technology, coupled with the subsequent epitaxial structure, packaging technology advances both mutual blessing, LED light-emitting efficiency of getting material to go beyond the traditional lamp performance.

　　Observed in lighting applications, lighting luminous efficacy for the increasingly high demand, while the LED light source technology currently around key performance light output, luminous efficiency mainly by epitaxy, grain and packaging technology solutions around performance. At present, the unit light-emitting efficiency has been the development of epitaxial approaching the limit, the luminous efficiency can be relatively limited growth jumping space, and continued to increase the grain size, improved packaging techniques can significantly increase the relative efficacy of the light-emitting element unit options. But to again enhance the cost element, the grain size increases than those without cost optimization of space, but is packaged terminal technology choices will directly affect the cost of the material component, ie, packaging technology will become a key cost LED lighting .