LED lighting to indoor lighting development

　　LED lighting market opportunity is huge, broad space for development. LED lighting applications have outdoor landscape lighting from the past to the development of indoor LED lighting applications. According to analysis of the development over the next five years, LED interior lighting will have exponential growth trend. 2011 its output will reach tens of billions of dollars. In particular, the first implementation of the 2009 EU plan to ban incandescent and energy-saving issues of concern, LED interior lighting created a huge market opportunity and optimistic outlook.

　　Development of high-power LED lighting depends on two elements: First, the chip itself; Second, lighting technology, including thermal, optical drive. The first is the chip, at present, the key LED chip technology development is the base material and epitaxial growth techniques. Sapphire substrate material by a conventional material, silicon and silicon carbide, the development of zinc oxide, gallium nitride, and other new materials. Whether it is for the overall lighting and accent lighting high power chip, or for decorative lighting and some simple auxiliary lighting, low-power chips, key technology upgrades are related to how to develop a more efficient, more stable chip. In just a few years, by means of a series of technical improvements, including chip structure, surface roughening and multi-quantum well structure including design, LED light efficiency to achieve a great breakthrough. Thin-film chip technology is super bright LED chip production core technology that can reduce the loss of light output on each side, and the bottom of the reflecting surface can help make more than 97% of the light output from the front. This not only significantly improve LED light efficiency, but also created favorable conditions for the convenience of the lens design.

　　In fact, the development of LED lighting since people have been concerned about its life, build a good cooling system if relying solely on the use of low thermal resistance of the LED elements are unable to lighting devices, but must be effectively reduced from PN node to the surrounding environment Thermal resistance, in order to greatly reduce the LED PN junction temperature, and the extension of the successful practice of LED lamp life and improve the actual flux goals. Different from the traditional lamps, both the printed circuit board carrier power LED is LED heat carrier, the heat sink and thermal design of the printed circuit board is very important. In addition, the luminaire manufacturer must also consider the quality of factors, thickness and size, and thermal interface connection, such as heat treatment and materials.