LED optical integrated packaging technology has more than 30 kinds
LED light integrated package structure existing more than 30 types, is gradually moving toward system integration package, is the future development direction of packaging technology.
(1) COB integrated package
COB integrated package of existing MCOB, COMB, MOFB, MLCOB more than 30 kinds of packaging structure, COB packaging technology matures, the advantage of low cost. COB package now accounts for about 40% of LED light source market, the luminous efficiency of 160 ~ 178 lm / w, thermal resistance of up to 2 ℃ / w, COB package is the recent trend of LED packaging development.
(2) LED garden-level package
Crystal-level package from the extension made of LED devices as long as a dicing, LED lighting is the demand for multi-system integrated package, the general substrate using silicon material, without solid crystal and pressure welding, and dispensing molding, forming system integration package , Its advantage is good reliability, low cost, is one of the packaging technology development.
(3) COF integrated package
COF integrated package is a large-area power LED chip assembled on a flexible substrate. It has the advantages of high thermal conductivity, thin layer flexibility, low cost, uniform light output, high luminous efficiency and flexible surface light source. It can provide line light source, surface light source and Three-dimensional light source of a variety of LED products, but also to meet the LED modern lighting, personalized lighting requirements, but also as a generic type of packaging components, the market prospects.
(4) LED module integrated package
Modular integrated package generally refers to the LED chip, drive power, control part (including IP address), parts and other system integration package, collectively referred to as LED module, with a saving material, reduce costs, can be standardized production, easy maintenance and many other advantages , Is the LED packaging technology development.
(5) Flip chip packaging technology
Flip chip packaging technology is a chip, substrate, bump to form a space, so the chip out of the package has a small size, high performance, short wiring, etc., using ceramic substrate, chip-chip, eutectic process, direct pressure To achieve high power lighting performance requirements. With the gold-tin alloy chip will be pressed on the substrate, replacing the previous silver plastic process, "direct pressure" instead of the past "reflow", with excellent electrical conductivity and thermal conductivity area. The packaging technology is an important trend of high-power LED packaging.
(6) Free chip technology package
Free packaging technology is a technology integration, the use of flip-chip, do not have solid crystal glue, gold wire and stent is a semiconductor packaging technology in 70 kinds of process formation. PFC package-free chip products can enhance the luminous efficiency to 200lm / w, light angle greater than 300 degrees ultra-wide-angle full-beam design, do not use the secondary optical lens, will reduce the loss of light efficiency and reduce costs, but to invest expensive equipment. PFC new products LED lighting market, especially in the application of candle lights, not only can simulate the shape of tungsten filament lamp, and can break the heat volume limit.
(7) LED other package structure
①EMC package structure: Embedded integrated package (Embedded LED Chip) will not directly see the LED light source.
(2) Epoxy Molding Compound (Epoxy Molding Compound) Epoxy Molding Compound encapsulation technology, with high heat resistance, high integration, anti-UV, small size and other advantages, but poor air tightness, is now in mass production.
③COG package: (Chip On Glass) LED chip will be placed on the glass substrate for packaging.
④ QFN packaging technology: a small pitch pixel display unit is less than or equal to P.1, the package used in the form, will replace the PLCC structure, the market prospects.
⑤ 3D packaging technology: three-dimensional form of packaging technology, is being developed.
⑥ power frame packaging technology: (Chip-in-Frame Package) in a small package on the framework of power LED chip, the industrialization of light efficiency has reached 160 ~ 170lm / w, up to 200lm / w or more.