LED packaging technology trends

　　1) large area of the chip package

　　Under replace the existing 0.3 x0.3 mm2 chip package with a small 1x1 mm2 large-size chip, chip injection current density can significantly improve the situation, is a major technology trends.

　　2) flip-chip technology

　　To solve the poor heat dissipation problem electrode block light sapphire, sapphire substrate surface from the light. Cook thick silver electrode on the p-reflector, then the key electrode bumps and bumps on the base together. Si base material with good heat dissipation in the system, and do a good job in the above anti-static circuits. According to the results of the U.S. Lumileds', flip-chip light efficiency increased by about 1.6 times. Chips can be greatly improved cooling capacity, using the flip chip technique the power light emitting diode to a low thermal resistance can be 12 ~ 15 ℃ / W.

　　3) metal bonding technology

　　This is a cheap and effective way to produce power LED. Is mainly made of metal and metal or a metal and the wafer bonding technology, good heat conductivity GaAs wafer or replace the sapphire substrate, a metal bonding type LED has strong heat dissipation capacity.

　　4) the development of high-power UV LED

　　UV LED coupled with tri-color phosphor provides another direction, the white color temperature stability is good, it needs many high quality applications (such as energy saving lamps) has been applied. Although this technology has all sorts of advantages, but there is still considerable technical difficulty, these difficulties include phosphors with ultraviolet wavelength selection, and the difficulty of making anti-UV LED UV packaging materials development and so on.

　　5) development of new phosphors and coating process

　　Phosphor coating process is to ensure the quality and the quality of the white LED key. Technology trends is to develop nano-crystal phosphor phosphor coated phosphor technology, the development of a uniform fluorescent phosphor plate technology in the coating process, the packaging materials are mixed with the phosphor technology.