thermal power LED application products Precautions

　　Due to the current limitations of the semiconductor light-emitting diode chip technology , LED photoelectric conversion efficiency to be improved, especially in high-power LED, because of its high power , about 60 % of the energy becomes heat release ( along with the development of semiconductor technology photoelectric conversion efficiency will gradually increase ) , which requires the application of high- end customers in the LED product, cooling work to do to ensure that high-power LED products work properly.

　　1 . Heat sink requirements

　　Appearance and texture : If the finished sealing ask, convection can occur directly with outside air environment , we recommend using with aluminum or copper fin heat sink .　2 . Effective heat dissipation surface area:

　　2 . Effective heat dissipation surface area:

　　For 1W high power LED white ( other colors basically the same ) Division I recommend heat sink surface area to dissipate heat effectively sum ≥ 50-60 square centimeters . For 3W products, recommended the sum of the surface area of the heat sink to dissipate heat effectively ≥ 150 square centimeters, depending on the situation and increase the higher power test results , try to ensure that the heat sink temperature does not exceed 60 ℃.

　　3 . Connection method:

　　High-power LED heat sink substrate and please ensure that the two contact surfaces smooth, good contact , to enhance the degree of integration of the two contact surfaces is recommended in the bottom of the LED heat sink substrate or surface coated with a layer of thermal grease ( thermal grease thermal conductivity connection ≥ 3.0W/mk), requires thermal grease applied evenly, amount, and then press fit screw fixation .