United States has developed a new thermal interface material to help LED cooling

　　But U.S. researchers by electro-polymerization process the polymer fibers arranged in neat array, forming a new type of thermal interface material whose thermal performance has increased 20 times based on the original material. The new material can work at a temperature up to 200 ℃, which can be used for help the heat of the server, automobiles, high-brightness LED and other electronic equipments. The research is published in advance on the recent magazine online edition of "Nature Nanotechnology ".

　　As electronic devices become more powerful and smaller in size, thermal issues are becoming increasingly complex. Engineers have been looking for better thermal interface materials to help electronic devices dissipate heat effectively. The amorphous polymer material is a poor conductor of heat since they limit the heat conduction transfer with disorder phonon. Although the crystal structure can be aligned to create in the polymer to improve its thermal conductivity, these structures are formed of a fiber drawing process, which will cause the brittle of the material.

　　Balatude Clarke, assistant Professor from Georgia Institute of Technology, George Woodruff School of Mechanical Engineering, said the new thermal interface material is made with the use of conjugated polymers polythiophene its neat nanofiber arrays conducive to the transfer of phonons, but also to avoid brittle materials . The new material 's thermal conductivity at room temperature of 4.4 W / m  Kelvin , and has carried out at a temperature of 200 ℃ 80 thermal cycles testing, performance remains stable; thermal interface contrast, between the chip and heat sink used solder materials may become unreliable when working in high temperature reflow process in.