Seven cooling solutions of LED

  With the wide application of LED, LED heat problem is attached more and more importance. LED thermal performance will directly affect the lifespan of LED products.

Seven cooling solutions of LED

  Scenario 1, aluminum fins

  This is the most common way of cooling, aluminum fins as part of the housing to increase the cooling area.

  Scenario 2, thermal plastic case

  LED thermal insulation using plastic replacement heat sink aluminum production can significantly improve the thermal radiation.

  Scenario 3, the air hydrodynamics

  Using the shape of the lamp to create a convection air, which is the way to costing lowest enhance heat dissipation.

  Scenario 4, the liquid bulb

  The use of liquid bulb packaging technology can fill the lamp body with high thermal conductivity transparent liquid f. This is a method, in addition to reflective principle, to use LED chip smooth thermal conductivity and thermal technology.

  Utilization scheme 5, the lamp

  In the home-based lower power LED lamps, lamp often use an internal space, the driver circuit portion or all of the heat into. Such as screw cap can be used with such a large cooling metal surface of the lamp, because the lamp is a metal electrode and the socket-contact power supply line. So part of the heat can be derived therefrom heat.

  Scenario 6, thermal insulation aluminum plastic alternative

  Thermal insulation of aluminum alloy heat sink plastic alternatives, this LED thermal plastic insulation, while maintaining cooling capacity with aluminum flat, raise the heat radiation 4-8 times. With this heat produced by the LED heat sink materials significantly enhance the overall physical cooling effect.

  Scenario 7, thermal heat integration - the use of high thermal conductivity ceramic

  The purpose is to reduce the heat of the lamp envelope of the operating temperature of the LED chip, the LED chip we used the thermal expansion coefficient and thermal conductivity of metal, thermal expansion coefficient, a large gap between the material can not be welded directly to the LED chip, so high, low thermal stress damage of the LED chip. New ceramic material with high thermal conductivity, thermal conductivity close to aluminum, the expansion factor can be adjusted to synchronize with the LED chip. This can be thermal, heat integration, reduce heat conduction intermediate links.

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