In conventional LED package, through the sapphire substrate and the wafer must be insulated plastic handle wafer heat conduction, relative without package LED technology for the use of flip chip (Flip-chip) wafer eutectic structure and the metal substrate production technology concept in the LED package body without encapsulation element may be flip-chip and the metal substrate because of the design of a eutectic structure, so that the element itself, the performance of the lower thermal resistance, and therefore no encapsulation technologies in the same LED driving wattage chip emitting core region can effectively reduce the temperature, but also can reduce the chip temperature continued high temperatures may cause component failure or shorten the life of the issue.
But no package LED is not a perfect process technology, because to achieve non-encapsulated LED design purpose, must also have epitaxy, grain, packaging process and the finished surface mount component technology integration, integration of technical difficulty is quite high, especially in the key flip chip structure design, no packaged LED components to maintain high reliability performance is actually quite high degree of difficulty, mainly to seek high reflectivity, high thermal conductivity and adhesion of two very good material, and these materials must have high stability qualities, but also must be able to withstand environmental conditions of high temperature, high pressure, high-current components during operation.
In addition, non-encapsulated LED itself without the outer package for protection, lighting equipment To set the high temperature, high humidity, harsh environment, must also be a protective layer against the elements designed to increase the service life of the light source device.
In addition, no encapsulation of the LED manufacturing process, the packaging process for the use of the working section an alternative to traditional fluorescent film packaging material, and are also placed inside the fluorescent film phosphor for LED with a phosphor to produce white light source and , i.e., the choice of phosphor LED will be left free of the encapsulating element reliability, light efficiency, the lighting state of the high temperature performance applications.
Although no package LED lamps LED lamps can improve the heat dissipation problem, but it is not perfect, no need to think about integrating technology package, the difficulty is quite high, difficult and inevitably involves costs, depends on whether the dominant technology maturity.