LED applications is now becoming more diversified, due to the high-power LED input power of only 15 to 20% into light, and the remaining 80-85% is converted into heat, if heat is not timely discharged to the outside world, then will make the LED High Bay chip interface temperature is too high to affect the luminescence efficiency and luminescence lifetime from the top led lighting companies. As the LED materials and packaging technologies continue to develop, to promote the brightness of the LED products, continuously improve, more and more wide application of LED, the LED as a backlight of the display, it is the recent hot topic is mainly different types of LED backlight technology more in color, brightness, life, low power consumption, degree, and environmental aspirations than traditional cold cathode fluorescent (CCFL), and therefore, actively involved in attracting industry.
The first single-chip LED power is not high heat, heat a big problem, so the package is relatively simple. As the LED materials technology continue to make breakthroughs in recent years, LED packaging technology change, and gradually developed into a flat, large area multi-chip package module from the shells of the early single-chip type package; its operating current from the early 20mA about low-power LED Street Light, progress to 1/3 to about 1A, high power LED, single LED input power up to 1W, even up to 3W, 5W package evolution.
In lighting applications, such as the mini-projector, vehicle and lighting light source, the required amount of lumens in a particular area need more than thousands of lumens, or ten thousand of lumens, single-chip package module alone is clearly insufficient to meet toward multi-chip LED package, and chip adhesion substrate future trends of the top led lighting companies.
Heat problem is a major obstacle for LED development for lighting objects from top led lighting companies, using a ceramic or heat pipe is to prevent overheating, but the thermal management solutions to the rising costs of materials, high power LED thermal management designed to effectively reduce R junction-to-case thermal resistance between the chip cooling to the final product, one solution of the material, to provide low thermal resistance, high conductivity, to make the heat directly transmitted from the chip to chip attached or hot metal outside of the package shell.