Recent progress in TV, LCD, Cell-Phone, the PC (Notebook) and other portable use and living appliances and other electronic products, high performance, miniaturization, integration, Module, such as rapid. High-performance needs more energy consumption LED built-in electronic products, contrary to miniaturization and integration to the product of the size constraints.
Markets tend to improve the power LED package that can accommodate the design Maigin sharply reduce. Module of the heat issue is no longer simply a problem of the LED products, but the question of the overall System.
Heat within the LED heat dissipation package Chip effective management is not the product of electrical / optical characteristics of the problem, but as the impact of product life, reliability, manufacturing costs, and other elements. In particular, take the LED application products (led high bay), have different characteristics with the use of temperature, drive current power consumption rate of heat and light.
Hot if not well controlled power that occurs, it will make the products of the same specifications as the different light efficiency and directly lead to the competitiveness of their products. The high power consumption also has good heat dissipation structure of the product is the most competitive market of LED heat dissipation.
This column will be the Board level thermal cooling technology in the various elements to be resolved.
The concept and composition of the metal PCB, but it is necessary for LED heat dissipation technology.
The circuit on the main printed circuit board (Printed Circuit Board) is made of glass fiber and epoxy composite with insulating layer FR-4 board.