The technical problems of LED street light
Although the high-power LED have quickly development, in the application also have lumens low efficiency of processing lower level secondary light, low light efficiency, the light fades fast, short life, color temperature deviation, different light color, multi-drive failures and other issues. The main technical of secondary optical design, thermal design and power regulator system design is the key point to improving the luminous efficiency and longer life.
To really give full play to the strengths of the semiconductor light source, LED secondary optical system design for LED street light and optical output efficiency is essential. All optical light good road lighting requirements of LED lights with light emitted from a rectangular type, street just can cover the road, and the road outside light pollution is almost zero.
Currently LED Lambertian radiation in the form of side-launched, bat wing, rectangular, butterfly wings and concentrating several. By the second optical design, making the LED light range, luminosity curve to meet the needs of road lighting.
LED lighting is used in embedded, due to heat large LED chip, made ??of high-power lamps when the key technology is the "heat." Although more and more high luminous efficiency, but the heat of the LED chip is still great. PN junction junction temperature increased by 10 degrees, the lifetime of the semiconductor device to reduce a fold. The high temperature of the LED chip and the package the chip itself deteriorate the resin properties, which eventually cause lower efficiency and a shorter light-emitting lifetime.
LED lighting companies have taken different cooling measures, mostly using integrated, systematic thermal design concepts, application of high performance thermally conductive material. Such as aluminum die casting, aluminum extrusion heat sink teeth, tooth integral heat sink, aluminum extrusion profiles tooth row radiator, fin-shaped heat pipe length, external tooth structure pieces, natural circulation of body heat and so on. There are ultra-alloy heat pipe (copper thermal speed of 100 times) and high-density aluminum cooling fins combined. The heat generated by the chip quickly from point sources into line source, so that a uniform distribution of heat to the heat sink. Heat sink down, to avoid the accumulation of dust guano. Chip packaging, heat lamps and other factors may cause light attenuation.